Computational Imaging Changes the World
Computational Imaging Changes the World
Leading International Supplier of Light Field Cameras System
Established in 2019, VOMMA (Shanghai) Technology Co., Ltd. is a leading supplier of light field cameras in the world. It is a scientific and technological achievements transformation project of Shanghai Jiao Tong University. Its core product, light-field camera, combines computational imaging technology to achieve the instantaneous recording of multi-dimensional light information. It has the capability of single shooting and instantaneous three-dimensional modeling, and features micro-nano precision, millisecond calculation and passive measurement. It won the "Gold Award of Machine Vision Innovation Product of the Year" at the 2020 Munich-Shanghai Light Fair.
During the production process of the screen, bright spots, scratches or foreign matters may appear on the screen, resulting in 100% mandatory scrapping. The screen defect 3D detection scheme of Yimu Technology can accurately locate the level information and 3D orientation of defects through a single shot, and fundamentally prevent the problem of forced scrapping caused by screen defects.
During the delivery of AR/VR equipment, it is necessary to detect whether the distance between the projected virtual image surface and the eyes meets the design value, so as to reduce the discomfort caused by the mismatch between the two eyes. The three-dimensional detection scheme of Yimu Technology can obtain the three-dimensional information of the entire object space in a single shot, and quickly complete the three-dimensional detection of virtual image surface.
Detect the welding process defects of the new energy battery panel, and check whether there are pinhole welding pits in the solder joints, which lead to the solder joints are not solid and abnormal, so as to avoid the potential safety hazards of the battery caused by the solder joints. The detection scheme of Yimu Technology can accurately locate the type and three-dimensional orientation of defects through a single shot, and fundamentally prevent the problem of forced scrapping caused by various defects in industry.
A variety of defects such as broken wire, springing, parallel wire, and dropped wire of the chip gold wire may lead to 100% mandatory scrapping of the chip. The chip gold line 3D detection scheme of Yimu Technology can accurately locate the type and 3D orientation of defects through a single shot, and fundamentally prevent the problem of forced scrap caused by chip gold line defects.
